AMD Alveo V80,Dual-core Arm Cortex-A72 32 GB, Compute Accelerator Card

Versal HBM XCV80 adaptive SoC is built for workloads that demand massive data movement and real-time processing. It combines a powerful dual-core Arm Cortex-A72 application processor with a Cortex-R5F real-time core, 32 GB of HBM2e memory and a suite of high-speed connectivity blocks, letting you tackle AI inference, 5G base-band, financial analytics or large-scale simulation without hitting bandwidth or latency walls.

Versal HBM XCV80 adaptive SoC - the answer to data-intensive bottlenecks

Modern data-centric applications often stall because the processor cannot fetch data quickly enough from memory or move it across network links. This creates latency, reduces throughput and inflates power consumption as the system works harder to compensate. The Versal HBM XCV80 solves these issues by placing 32 GB of HBM2e DRAM directly on the die, delivering a peak bandwidth of 810 GB/s. Integrated high-speed crypto engines, multirate Ethernet MACs and Interlaken links ensure that data can be encrypted, routed and aggregated at line rate, keeping your pipelines flowing smoothly and securely.

Benefits

The device’s 2.6 million lookup tables and 10 848 DSP slices give you ample logic resources to implement complex algorithms in hardware, reducing reliance on external accelerators. On-chip embedded memory of 673 Mb (including UltraRAM) provides fast scratch-pad space for latency-critical operations, while the dual-core Arm Cortex-A72 delivers high-performance software execution for control and orchestration tasks. Real-time responsiveness is guaranteed by the Cortex-R5F core, which can handle deterministic workloads such as signal processing or control loops. Three 400 Gb/s crypto engines protect data in transit with IPsec or MACsec without sacrificing speed. The combination of six 100 Gb/s multirate Ethernet MACs, three 600 Gb/s Ethernet MACs and a 600 Gb/s Interlaken interface gives you flexible, high-throughput networking options for data centre, telecom or edge deployments.

Usages

• AI inference servers that need ultra-high memory bandwidth for large models.
• 5G base-band units requiring low-latency processing and secure data paths.
• Financial-services platforms performing real-time risk analysis on massive data streams.
• High-performance computing clusters that benefit from on-chip HBM and extensive DSP resources.
• Edge devices that must encrypt traffic at line rate while maintaining deterministic response times.

Key Features

Device: Versal HBM XCV80 adaptive SoC device.

Look-up Tables (LUTs): 2.6 M for flexible logic implementation.

DSP Slices: 10 848 for intensive signal-processing tasks.

On-Chip Embedded Memory: 673 Mb (132 Mb block RAM, 541 Mb UltraRAM).

HBM Memory: 32 GB HBM2e DRAM (2 × 16 GB stacks).

Peak Bandwidth: 810 GB/s to feed data-hungry workloads.

High-Speed Crypto Engines: 3 × 400 Gb/s engines supporting bulk crypto, IPsec and MACsec.

Multirate Ethernet MAC: 6 × 100 Gb/s ports for versatile networking.

Ethernet MAC: 3 × 600 Gb/s ports for high-throughput links.

Interlaken: 1 × 600 Gb/s channel for chip-to-chip communication.

Application Processor: Dual-core Arm Cortex-A72 for high-performance software.

Real-Time Processor: Dual-core Arm Cortex-R5F for deterministic processing.

Platform Management: Integrated controller for system monitoring and configuration.

SDRAM: 4 GB onboard for Arm processor management.

Design Suite: Supported by AMD Vivado Design Suite for comprehensive development.

Example Design: AMD Alveo Versal Example Design to accelerate time-to-market.

Expansion Connectors: Mini Cool-Edge I/O (MCIO) for PCIe Gen5 and card-to-card extensions.

MCIO x4: 2 × MCIO x4 connectors for additional peripheral bandwidth.

MCIO x8: 1 × MCIO x8 connector for high-density expansion.

GTYP Transceivers: 32 × GTYP transceivers (32.75 Gb/s each) for flexible optical links.

GTM Transceivers: 16 × GTM transceivers (56 Gb/s each) for high-speed serial interfaces.

DDR4 Expansion: 32 GB DDR4 DIMM slot for extra memory when required.

Optical Ports: 4 × QSFP56 ports (2 × 100 Gb/s or 4 × 10/25/40/50 Gb/s per port).

Card Form Factor: Full-Height, ¾ Length (FH¾L) dual-slot board for standard racks.

TDP: 190 W with passive cooling, simplifying system design and reducing total cost of ownership.

The Versal HBM XCV80 adaptive SoC brings together unprecedented memory bandwidth, extensive processing resources and versatile connectivity in a single, power-efficient package. Whether you are building the next generation of AI accelerators, secure 5G infrastructure or high-speed data-center appliances, this device gives you the performance headroom and flexibility to stay ahead of demand.

Specifications