Tired of server slow-downs when handling massive data sets? The 32 GB DDR5 RDIMM delivers ultra-fast 6000 MT/s bandwidth with low CL32 latency, keeping every transaction smooth and eliminating bottlenecks. It’s a registered memory module designed for data-centre and enterprise workloads, giving you reliable, error-free performance when you need it most.
Usages of a 6000MT/s RDIMM
Ideal for high-performance environments, this module fits seamlessly into daily operations:
- Virtualisation hosts running multiple VMs
- AI inference servers processing large models
- Database servers handling intensive queries
- High-frequency trading platforms requiring instant data access
- Cloud infrastructure nodes supporting heavy multitasking
Kingston Technology RDIMM
Enterprises and data-centre managers who demand consistent uptime often struggle with memory errors and limited bandwidth. Traditional modules can’t keep pace with modern workloads, leading to latency spikes and costly downtime. This RDIMM solves those issues by offering registered architecture, on-die ECC and pre-loaded EXPO 1.1 overclocking, ensuring stable, high-speed operation for demanding applications.
Key Features of a 6000MT/s RDIMM
- Data rate: 6000 MT/s. Provides the fastest transfer speeds for DDR5 workloads.
- CAS latency: CL32. Keeps response times tight for smoother processing.
- Voltage: 1.35 V. Reduces power draw while maintaining performance.
- Programming power voltage: 1.8 V. Guarantees stable signal integrity during operation.
- Form factor: 288-pin DIMM. Fits standard dual-channel server slots.
- ECC: Yes (on-die and full). Protects against data corruption for mission-critical tasks.
- Heatsink: Integrated. Helps dissipate heat during intensive use.
- Lead plating: Gold. Improves conductivity and longevity.
- EXPO 1.1 profile: Yes. Enables automatic overclocking without manual tuning.
- Weight: 21.7 g, Height: 3.8 mm. Allows dense rack installation without adding bulk.
Benefits of Kingston Technology RDIMM
You gain instant bandwidth gains that speed up virtualisation and AI workloads, while the built-in ECC safeguards data integrity, reducing the risk of costly errors. The EXPO-enabled overclocking pushes performance beyond standard limits without extra configuration, saving you time. Efficient power consumption lowers energy costs, and the robust heatsink plus gold-plated leads extend the module’s lifespan, protecting your investment.
Specifications
| Features |
|
| JEDEC standard |
Yes |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Product colour |
Black |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) version |
1.1 |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
4096M x 80 |
| Memory voltage |
1.35 V |
| Memory ranking |
1 |
| Memory channels |
Dual-channel |
| CAS latency |
32 |
| On-Die ECC |
Yes |
| ECC |
Yes |
| Memory form factor |
288-pin DIMM |
| Component for |
PC/Server |
| Memory data transfer rate |
6000 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
1 x 32 GB |
| Internal memory |
32 GB |
| Buffered memory type |
Registered (buffered) |
| Operational conditions |
|
| Storage temperature (T-T) |
-55 – 100 °C |
| Operating temperature (T-T) |
0 – 95 °C |
| Sustainability |
|
| Sustainability compliance |
Yes |
| Doesn't contain |
Halogen |
| Technical details |
|
| Compliance certificates |
RoHS |
| Weight & dimensions |
|
| Weight |
21.7 g |
| Height |
31.2 mm |
| Depth |
133.3 mm |
| Width |
3.8 mm |
| Packaging data |
|
| Package weight |
34.72 g |
| Package height |
171.4 mm |
| Package depth |
14 mm |
| Package width |
57.1 mm |
| Other features |
|
| Internal memory |
32 GB |
