Stuck with lag and slow load times on your new gaming rig or workstation? Upgrading to faster memory can instantly lift performance bottlenecks. The Kingston Technology (KF552C40BBAK216), 16 GB, 2 x 8 GB DDR5, 288-pin DIMM delivers the speed and reliability you need, letting you run demanding applications and games without compromise.
Why Choose Kingston DDR5
Modern CPUs demand memory that can keep up, and without enough bandwidth you’ll see frame drops and sluggish multitasking. This DDR5 module solves that by offering a high data-transfer rate that matches next-gen platforms, ensuring smooth operation and future-proofing your build. It also includes built-in lighting sync for a clean, coordinated look inside your case.
Usages of a 16 GB DDR5
Ideal for high-end gaming PCs, content-creation workstations, and AI-focused laptops, this 16 GB DDR5 kit provides the capacity and speed required for large textures, complex simulations, and heavy multitasking, letting you edit 4K video, render 3D models, or dominate the latest titles with ease.
Benefits of Kingston DDR5
You gain ultra-fast data access that cuts load times, while the on-die ECC safeguards data integrity during intense workloads. The module’s heat-spreaders keep temperatures low, extending lifespan. Compatibility with Intel XMP 3.0 and AMD EXPO means simple, one-click overclocking. Finally, the limited lifetime warranty gives you peace of mind for years to come.
Key Features of a 16 GB DDR5
- JEDEC standard: Yes. Guarantees industry-wide compatibility.
- Backlight colour: Red/Green/Blue. Lets you customise vibrant RGB effects.
- Lead plating: Gold. Provides superior conductivity and corrosion resistance.
- Cooling type: Heatsink. Efficiently dissipates heat for stable performance.
- Memory voltage: 1.25 V. Optimised power consumption for reliable operation.
- CAS latency: 40. Balances speed and latency for responsive computing.
- On-Die ECC: Yes. Enhances data accuracy during heavy tasks.
- Memory data transfer rate: 5200 MT/s. Delivers high bandwidth for demanding applications.
- Module configuration: 1024M x 64. Defines the internal arrangement for optimal performance.
- Weight: 83.96 g. Light enough for easy installation without adding bulk.
Specifications
| Features |
| JEDEC standard |
Yes |
| Backlight colour |
Red/Green/Blue |
| Backlight |
Yes |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| Intel Extreme Memory Profile (XMP) version |
3.0 |
| Intel Extreme Memory Profile (XMP) |
Yes |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
1024M x 64 |
| Memory voltage |
1.25 V |
| Memory ranking |
1 |
| CAS latency |
40 |
| On-Die ECC |
Yes |
| ECC |
No |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
5200 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
2 x 8 GB |
| Internal memory |
16 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
83.96 g |
| Height |
42.2 mm |
| Depth |
133.3 mm |
| Width |
7.11 mm |
| Packaging data |
| Package weight |
133.11 g |
| Package height |
171.4 mm |
| Package depth |
14 mm |
| Package width |
121.9 mm |
| Other features |
| Internal memory |
16 GB |
