Struggling with lag when you push games or creative apps to their limits? Kingston Technology (KF556C36BWEK232), 32 GB, 2 x 16 GB, DDR5, 288-pin DIMM gives you the speed and capacity you need for smooth performance, whether you’re gaming, streaming or rendering.
Usages of a 32 GB DDR5
- High-frame-rate gaming on the latest titles
- 4K+ live streaming without dropped frames
- Complex 3D rendering and animation projects
- Heavy multitasking with multiple design tools open
- Future-proofing a new build for upcoming software
Why Choose Kingston DDR5
If you build or upgrade a PC for demanding workloads, you know that ordinary memory can become a bottleneck. Many users face instability when overclocking or running intensive applications. Kingston DDR5 eliminates those frustrations by offering reliable, high-speed performance that matches modern CPUs and motherboards, letting you focus on creation rather than troubleshooting.
Key Features of a 32 GB DDR5
- Memory capacity: 32 GB. Provides ample room for large files and multitasking.
- Module configuration: 2 x 16 GB. Lets you install two sticks for dual-channel performance.
- Memory data transfer rate: 5600 MT/s. Delivers fast data movement for quick load times.
- CAS latency: 36. Balances speed and stability for smooth operation.
- Memory voltage: 1.25 V. Optimised power use while maintaining high performance.
- On-Die ECC: Yes. Helps keep data accurate during intense tasks.
- Cooling type: Heatsink. Keeps the modules cool under heavy loads.
- Lead plating: Gold. Ensures a solid connection and corrosion resistance.
- Height: 34.9 mm. Fits in most standard cases without clearance issues.
- Weight: 68.68 g per module. Light enough for easy handling during installation.
Benefits of Kingston DDR5
You’ll notice faster game load times and smoother frame rates, saving you the frustration of stutter. The built-in on-die ECC reduces errors, meaning fewer crashes and less time spent fixing problems. Dual-channel design improves overall system efficiency, cutting down on power consumption and heat. Compatibility with Intel XMP 3.0 and AMD EXPO lets you overclock safely, extracting more performance without extra effort. Overall, you get a reliable upgrade that extends the life of your PC while keeping costs sensible.
Specifications
| Features |
| JEDEC standard |
Yes |
| Backlight |
No |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) version |
1.0 |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
2048M x 64 |
| Memory voltage |
1.25 V |
| Memory ranking |
1 |
| CAS latency |
36 |
| On-Die ECC |
Yes |
| ECC |
No |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
5600 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
2 x 16 GB |
| Internal memory |
32 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
68.68 g |
| Height |
34.9 mm |
| Depth |
133.3 mm |
| Width |
6.62 mm |
| Packaging data |
| Package weight |
101.72 g |
| Package height |
171.4 mm |
| Package depth |
14 mm |
| Package width |
95.2 mm |
| Other features |
| Internal memory |
32 GB |
