When your workstation or server stalls under heavy workloads, the bottleneck is often memory speed and reliability. Kingston Technology (KF556R36RBK4128), 128 GB,4 x 32 GB DDR5, 288-pin DIMM Black delivers high-performance DDR5 capacity in a registered, ECC-enabled package, keeping data safe while boosting compute speed for demanding applications.
Usages of a 128 GB DDR5 DIMM
Ideal for professional environments that need fast, reliable memory.
- Running large AI or machine-learning models on a workstation.
- Supporting virtualization clusters with multiple VMs.
- Powering high-frequency trading platforms that require ultra-low latency.
- Enabling complex scientific simulations on a server.
- Managing extensive database workloads without slowdown.
Kingston Technology DDR5 DIMM
Professionals who build or upgrade servers, workstations, or high-end desktops know that standard memory often cannot keep up with modern workloads. You may have struggled with frequent crashes, slow data processing, or limited upgrade paths. This kit provides a seamless upgrade that matches next-gen Intel® and AMD platforms, delivering the speed you need without compromising the error-checking that critical systems rely on.
Key Features of a 128 GB DDR5 DIMM
- Memory capacity: 128 GB. Large storage for intensive tasks.
- Module configuration: 4096M x 80. High-density layout for maximum performance.
- Memory voltage: 1.25 V. Efficient power use reduces heat.
- Data transfer rate: 5600 MT/s. Fast bandwidth for quick data movement.
- CAS latency: 36. Balanced timing for responsive operation.
- ECC: Yes. Detects and corrects errors to protect data integrity.
- On-Die ECC: Yes. Adds an extra layer of error correction within each chip.
- Cooling type: Heatsink. Keeps the modules cool under load.
- XMP version: 3.0. Easy overclocking with pre-set profiles.
- Dimensions: 31.2 mm × 133.3 mm × 3.8 mm. Fits standard DIMM slots.
Benefits of Kingston Technology DDR5 DIMM
You gain peace of mind knowing your data is protected by ECC while enjoying the speed boost of DDR5, which shortens processing times and increases productivity. The built-in XMP 3.0 and AMD EXPO profiles let you optimise performance without manual tuning, saving you time and effort. Efficient power consumption lowers operating costs, and the robust heatsink ensures reliable operation even during prolonged heavy use.
Specifications
| Features |
| JEDEC standard |
Yes |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Product colour |
Black |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| Intel Extreme Memory Profile (XMP) version |
3.0 |
| Intel Extreme Memory Profile (XMP) |
Yes |
| Row Precharge Time (TRP) |
16 |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
4096M x 80 |
| Memory voltage |
1.25 V |
| Memory ranking |
1 |
| Memory channels |
Quad-channel |
| CAS latency |
36 |
| On-Die ECC |
Yes |
| ECC |
Yes |
| Memory form factor |
288-pin DIMM |
| Component for |
PC/Server |
| Memory data transfer rate |
5600 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
4 x 32 GB |
| Internal memory |
128 GB |
| Buffered memory type |
Registered (buffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 95 °C |
| Sustainability |
| Doesn't contain |
Halogen |
| Technical details |
| Compliance certificates |
RoHS |
| Weight & dimensions |
| Weight |
86.8 g |
| Height |
31.2 mm |
| Depth |
133.3 mm |
| Width |
3.8 mm |
| Packaging data |
| Package weight |
109.34 g |
| Package height |
35.6 mm |
| Package depth |
167.6 mm |
| Package width |
104.1 mm |
| Other features |
| Internal memory |
128 GB |
