When your workstation or server stalls because memory can’t keep up with demanding workloads, the bottleneck often lies in outdated or insufficient RAM. Kingston Technology (KF556R36RBK8256),256 GB,8 x 32 GB DDR5, 288-pin DIMM,Black delivers a massive 256 GB of high-speed DDR5 DIMM capacity, giving you the headroom to run complex simulations, large datasets and intensive applications without slowdown.
Kingston Technology DDR5 DIMM
You need reliable, error-correcting memory that can handle the pressure of modern compute tasks. Standard RAM can cause data corruption or crashes under heavy load, risking lost work and downtime. This DDR5 DIMM kit combines server-grade Registered design with overclockable performance, ensuring data integrity while pushing speed limits, so you stay productive and secure.
Usages of a 256 GB DDR5 DIMM
Ideal for high-end workstations, AI research rigs, and enterprise servers that require large, fast memory pools, this kit lets you run multiple virtual machines, large-scale databases, and GPU-accelerated workloads simultaneously without sacrificing stability.
Benefits of Kingston Technology DDR5 DIMM
You gain error-correcting ECC that automatically fixes multi-bit errors, protecting critical data. The built-in XMP 3.0 and AMD EXPO profiles let you achieve top speeds with a single BIOS setting, saving time on manual tuning. The heatsink design keeps temperatures low, extending module life. Plug-and-play overclocking means you get maximum performance out of the box, and the gold-plated contacts ensure a reliable connection even under heavy use.
Key Features of a 256 GB DDR5 DIMM
- Capacity: 256 GB. Provides a huge memory pool for demanding applications.
- Module configuration: 4096M x 80. Delivers a wide data path for fast access.
- Memory voltage: 1.25 V. Optimised power consumption for efficient operation.
- Memory data transfer rate: 5600 MT/s. Enables rapid data movement between CPU and RAM.
- CAS latency: 36. Balances speed and stability for smooth performance.
- ECC: Yes. Detects and corrects errors to maintain data integrity.
- On-Die ECC: Yes. Adds an extra layer of error protection within each chip.
- Cooling type: Heatsink. Keeps the modules cool during intensive tasks.
- Lead plating: Gold. Ensures durable, corrosion-resistant connections.
- Weight: 173.6 g. Light enough for easy installation while remaining robust.
Specifications
| Features |
| JEDEC standard |
Yes |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Product colour |
Black |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| Intel Extreme Memory Profile (XMP) version |
3.0 |
| Intel Extreme Memory Profile (XMP) |
Yes |
| Row Precharge Time (TRP) |
16 |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
4096M x 80 |
| Memory voltage |
1.25 V |
| Memory ranking |
1 |
| CAS latency |
36 |
| On-Die ECC |
Yes |
| ECC |
Yes |
| Memory form factor |
288-pin DIMM |
| Component for |
PC/Server |
| Memory data transfer rate |
5600 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
8 x 32 GB |
| Internal memory |
256 GB |
| Buffered memory type |
Registered (buffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 95 °C |
| Sustainability |
| Doesn't contain |
Halogen |
| Technical details |
| Compliance certificates |
RoHS |
| Weight & dimensions |
| Weight |
173.6 g |
| Height |
31.2 mm |
| Depth |
133.3 mm |
| Width |
3.8 mm |
| Packaging data |
| Package weight |
190.51 g |
| Package height |
35.6 mm |
| Package depth |
167.6 mm |
| Package width |
104.1 mm |
| Other features |
| Internal memory |
256 GB |
