Struggling with lag and unstable performance on demanding games or professional workloads? Kingston Technology (KF560C30BWEA-16), 16GB 6000MT/s DDR5 ECC DIMM RGB EXPO is a high-speed DDR5 memory module that delivers reliable, error-corrected performance while adding eye-catching RGB lighting. It keeps your system fast, stable and visually striking, so you can stay focused on what matters.
Kingston Technology (KF560C30BWEA-16), 16GB 6000MT/s DDR5 ECC DIMM RGB EXPO - the answer to unstable, slow memory
Modern PCs and workstations need memory that can handle massive data streams without errors. Without sufficient speed and stability, applications freeze, frames drop and data corruption can occur, especially under heavy load. This module solves those issues by offering 6000 MT/s transfer rates, on-die ECC for data integrity, and AMD EXPO/Intel XMP profiles that let you achieve optimal performance with a single click. The result is a smoother gaming experience, faster rendering, and peace of mind that your data remains intact.
Benefits
A quick look at what you gain:
- Lightning-fast 6000 MT/s bandwidth reduces load times and improves frame rates.
- On-die ECC automatically corrects single-bit errors, protecting your work and games.
- RGB lighting synchronises across components for a striking, personalised build.
- AMD EXPO and Intel XMP 3.0 profiles simplify overclocking, saving you time and effort.
- Limited lifetime warranty ensures long-term reliability and support.
Usages of Kingston Technology (KF560C30BWEA-16), 16GB 6000MT/s DDR5 ECC DIMM RGB EXPO
This module is ideal for high-performance gaming rigs, content-creation workstations, and servers that require error-corrected memory. It fits any DDR5-compatible motherboard that supports EXPO or XMP profiles, making it perfect for building a future-proof PC that can handle the latest titles, 3D rendering, video editing and data-intensive applications.
Key Features of Kingston Technology (KF560C30BWEA-16), 16GB 6000MT/s DDR5 ECC DIMM RGB EXPO
- Memory capacity: 16 GB. Provides ample room for multitasking and large datasets.
- Data transfer rate: 6000 MT/s. Delivers high-speed communication between CPU and RAM.
- CAS latency: 30. Balances speed and timing for responsive performance.
- Memory voltage: 1.35 V. Optimised power consumption while maintaining stability.
- On-Die ECC: Yes. Corrects errors in real time to keep data accurate.
- ECC: Yes. Adds an extra layer of reliability for critical applications.
- Heat spreader colour: White. Offers a clean aesthetic that matches many builds.
- Backlight colour: Red/Green/Blue. Enables full-spectrum RGB customisation.
- Cooling type: Heatsink. Helps maintain optimal temperatures during intense use.
- Compatibility: AMD EXPO 1.0 and Intel XMP 3.0 certified. Ensures easy profile loading on supported platforms.
Specifications
| Features |
| JEDEC standard |
Yes |
| Backlight colour |
Red/Green/Blue |
| Backlight |
Yes |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Product colour |
White |
| SPD profile |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) version |
1.0 |
| Memory voltage |
1.35 V |
| CAS latency |
30 |
| On-Die ECC |
Yes |
| ECC |
Yes |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
6000 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
1 x 16 GB |
| Internal memory |
16 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
42.38 g |
| Height |
44 mm |
| Depth |
133.3 mm |
| Width |
7.66 mm |
| Packaging data |
| Package weight |
63.55 g |
| Package height |
171.4 mm |
| Package depth |
14 mm |
| Package width |
57.1 mm |
| Other features |
| Internal memory |
16 GB |
