Struggling with lag-filled games or slow rendering? Upgrade to a fast, reliable memory kit that lets your PC keep up with demanding workloads. This Kingston Technology (KF560C36BBEK216), 16 GB, 2 × 8 GB, 6000 MT/s DDR5 DIMM RAM delivers the bandwidth and stability you need for smooth gaming, 4K streaming and heavy-duty content creation, all while fitting neatly into standard desktop slots.
Kingston Technology DDR5 RAM
Modern titles and professional apps demand more than just basic memory; they need speed, capacity and error-free operation. Without enough bandwidth, frames drop, textures pop and rendering stalls, which hurts both performance and enjoyment. This DDR5 kit solves those issues by providing a high-speed data path and built-in error correction, ensuring your system runs at its full potential without crashes or instability.
Usages of a 6000 MT/s DDR5 RAM
Ideal for high-end gaming rigs, 4K livestream setups and workstations handling animation or 3D modelling, this kit gives you the extra headroom to push settings to the max, stream smoothly and render complex scenes faster.
Benefits of Kingston Technology DDR5 RAM
You gain ultra-fast data transfer that cuts load times, on-die ECC that protects against errors during intense overclocking, a low-profile heatsink that keeps temperatures low without taking up space, gold-plated contacts for lasting reliability, and ready-made XMP 3.0 and AMD EXPO profiles that let you optimise performance with a single click. All these features combine to give you a smoother, more responsive PC experience.
Key Features of a 6000 MT/s DDR5 RAM
- Memory data transfer rate: 6000 MT/s. Provides the high bandwidth needed for demanding games and applications.
- Capacity: 16 GB (2 × 8 GB). Gives enough memory for multitasking and large projects.
- Memory voltage: 1.35 V. Ensures stable operation at high speeds while staying power-efficient.
- CAS latency: 36. Balances speed and timing for responsive performance.
- On-Die ECC: Yes. Corrects internal errors to maintain data integrity during heavy loads.
- Cooling type: Heatsink. Dissipates heat effectively, keeping the modules cool under load.
- Lead plating: Gold. Improves contact reliability and reduces corrosion over time.
- Module configuration: 1024M × 64. Optimised layout for efficient data handling.
- Weight: 66.08 g. Light enough for easy installation without stressing the motherboard.
- Height: 34.9 mm. Low-profile design fits most builds, even those with limited clearance.
Specifications
| Features |
| JEDEC standard |
Yes |
| Backlight |
No |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) version |
1.0 |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
1024M x 64 |
| Memory voltage |
1.35 V |
| Memory ranking |
1 |
| CAS latency |
36 |
| On-Die ECC |
Yes |
| ECC |
No |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
6000 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
2 x 8 GB |
| Internal memory |
16 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
66.08 g |
| Height |
34.9 mm |
| Depth |
133.3 mm |
| Width |
6.62 mm |
| Packaging data |
| Package weight |
101.72 g |
| Package height |
171.4 mm |
| Package depth |
14 mm |
| Package width |
95.2 mm |
| Other features |
| Internal memory |
16 GB |
