Tired of lag when you push games or render videos at the highest settings? Upgrading to a faster, more reliable memory kit can erase those bottlenecks. Kingston Technology (KF560C36BWEK264), 64 GB, 2 × 32 GB, DDR5, 288-pin DIMM delivers the bandwidth and stability you need for demanding workloads, letting you stay ahead of the curve.
Why Choose Kingston DDR5 DIMM
Modern PCs demand memory that can keep pace with powerful CPUs and graphics cards. Without enough speed or capacity, you’ll see frame drops, longer render times, and reduced multitasking efficiency. This DDR5 DIMM solves those issues by offering ultra-high transfer rates and built-in error correction, ensuring smooth performance even under extreme loads. It fits seamlessly into the latest Intel and AMD platforms, giving you a clear path to peak performance.
Usages of a 64 GB DDR5 DIMM
Ideal for high-end gaming rigs, 4K+ livestreaming setups, and professional 3D rendering or animation workstations, this kit provides the headroom to run multiple applications, large textures, and complex simulations without slowdown.
Benefits of Kingston DDR5 DIMM
You gain rock-solid stability thanks to on-die ECC, which protects data during intense overclocking. The dual 32-bit subchannels boost efficiency, translating into faster load times and smoother frame rates. Built-in PMIC profiles let you fine-tune speeds with Intel XMP 3.0 or AMD EXPO, simplifying overclocking. The low-profile heat spreader keeps temperatures low while adding a sleek look. Gold-plated contacts ensure reliable connectivity over the long term.
Key Features of a 64 GB DDR5 DIMM
- Memory capacity: 64 GB. Plenty of space for large games and professional workloads.
- Speed: 6000 MT/s. Delivers rapid data transfer for smoother performance.
- CAS latency: 36. Balanced timing that supports high-speed operation.
- Voltage: 1.35 V. Optimised power consumption for stable overclocking.
- On-Die ECC: Yes. Improves data integrity when pushing the module to its limits.
- Module configuration: 2 × 32 GB. Easy dual-channel setup for maximum bandwidth.
- Heat spreader: Low-profile design. Provides effective cooling without adding bulk.
- Lead plating: Gold. Enhances contact reliability and reduces corrosion.
- Dimensions (H × W × D): 34.9 mm × 6.62 mm × 133.3 mm. Fits standard DIMM slots comfortably.
- Compatibility: Intel XMP 3.0 and AMD EXPO certified. Works with a wide range of modern motherboards.
Specifications
| Features |
| JEDEC standard |
Yes |
| Backlight |
No |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Programming power voltage (VPP) |
1.8 V |
| SPD profile |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) version |
1.0 |
| Row active time |
32 ns |
| Refresh row cycle time |
295 ns |
| Row cycle time |
48 ns |
| Module configuration |
4096M x 64 |
| Memory voltage |
1.35 V |
| Memory ranking |
2 |
| CAS latency |
36 |
| On-Die ECC |
Yes |
| ECC |
No |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
6000 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
2 x 32 GB |
| Internal memory |
64 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
70.26 g |
| Height |
34.9 mm |
| Depth |
133.3 mm |
| Width |
6.62 mm |
| Packaging data |
| Package weight |
101.72 g |
| Package height |
171.4 mm |
| Package depth |
14 mm |
| Package width |
95.2 mm |
| Other features |
| Internal memory |
64 GB |
