Tired of lag when you push games, stream in 4K or render complex 3D scenes? Kingston Technology (KF564C32BWEK264), 6400MT/s, 64 GB, 2 × 32 GB, DDR5, DIMM gives you the memory bandwidth and capacity to keep every frame smooth and every application responsive. With two high-capacity modules you instantly boost multitasking, reduce load times and future-proof your rig for the next-gen platform.
Why Choose Kingston DDR5 DIMM
Modern PCs need memory that can keep up with fast CPUs and demanding workloads. Without enough speed or capacity you’ll see stutters, longer render times and limited ability to run multiple programmes at once. This DDR5 kit solves those issues by delivering industry-leading transfer rates and a total of 64 GB, ensuring the system can handle heavy loads without compromise. It works with Intel XMP 3.0 and AMD EXPO profiles, so you can overclock safely and easily.
Usages of a 6400MT/s DDR5 DIMM
Ideal for high-performance gaming rigs, 4K+ livestream setups, professional animation workstations and intensive data-analysis PCs, this memory lets you run the latest titles on ultra settings, stream without drops, and render large scenes faster than ever.
Benefits of Kingston DDR5 DIMM
You get rock-solid stability thanks to on-die ECC that protects data during extreme speeds. The dual 32-bit subchannels improve efficiency, giving smoother multitasking. Built-in PMIC lets you fine-tune overclocking with XMP 3.0 or AMD EXPO profiles, so you extract maximum performance without manual fiddling. The low-profile heat spreader keeps temperatures low, extending the life of your modules. Gold-plated contacts ensure reliable signal transfer for years of use.
Key Features of a 6400MT/s DDR5 DIMM
- Memory data transfer rate: 6400 MT/s. Provides the high bandwidth needed for demanding applications.
- Capacity: 64 GB (2 × 32 GB). Allows extensive multitasking and large data sets.
- CAS latency: 32. Balances speed and responsiveness for smooth operation.
- Memory voltage: 1.4 V. Optimised power delivery for stable performance.
- On-Die ECC: Yes. Enhances data integrity when running at peak speeds.
- Dual 32-bit subchannels: Enabled. Improves data handling efficiency.
- Heat spreader: Low-profile design. Improves cooling while fitting tight builds.
- Lead plating: Gold. Ensures durable, low-resistance connections.
- Cooling type: Heatsink. Keeps the modules cool under heavy load.
- XMP 3.0 & AMD EXPO: Certified. Simplifies overclocking with pre-set profiles.
Specifications
| Features |
| JEDEC standard |
Yes |
| Backlight |
No |
| Lead plating |
Gold |
| Cooling type |
Heatsink |
| Country of origin |
China, Taiwan |
| Product colour |
White |
| SPD profile |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) |
Yes |
| AMD Extended Profiles for Overclocking (EXPO) version |
1.0 |
| Memory voltage |
1.4 V |
| CAS latency |
32 |
| On-Die ECC |
Yes |
| ECC |
No |
| Memory form factor |
288-pin DIMM |
| Component for |
PC |
| Memory data transfer rate |
6400 MT/s |
| Internal memory type |
DDR5 |
| Memory layout (modules x size) |
2 x 32 GB |
| Internal memory |
64 GB |
| Buffered memory type |
Unregistered (unbuffered) |
| Operational conditions |
| Storage temperature (T-T) |
-55 - 100 °C |
| Operating temperature (T-T) |
0 - 85 °C |
| Weight & dimensions |
| Weight |
69.18 g |
| Height |
34.9 mm |
| Depth |
133.3 mm |
| Width |
6.62 mm |
| Packaging data |
| Package weight |
101.72 g |
| Package height |
171.4 mm |
| Package depth |
14 mm |
| Package width |
95.2 mm |
| Other features |
| Internal memory |
64 GB |
